VAC Inline

Inline Vapor Phase Reflow

 

The VAC Inline Series is an environmentally friendly and flexible
soldering system dedicated for highest quality soldering. This
machine can be fully integrated into a production line and if
necessary also be used in the batch mode The patented vacuum
chamber located in the process chamber ensures that highest
solder quality with a minimum amount and size of voids is possible.
Outstanding performance and quality results through the unique
technology applied in these machines. Regardless of the number of
layers in the board and high mix of components this machine can
handle the tough est applications with fantastic results. The
Intelligent Profiling System gives the user full control of temperature
rise to reach the best and desired soldering profiles. Together with
the unique patented Soft Vapour Phase there is no fear of
exceeding temperature increase rates of component s. Their
outstanding low energy consumption and exhaust air volume
compared to other soldering systems result in even lower running
costs. Excellent heat transfer in an inert oxygen free atmosphere
without the need of costly nitrogen. Two chamber system wi th a
large touch display makes this machine user friendly, easy to set up
and use. Soldering is possible regardless of assembly weight with
the same profile.

 

Specifications
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Specifications (Fr) Specifications (Eng)

Width

2040 mm – (80,31“)

Depth

3040 mm – (119.69“)

Height

1470 mm – (57.87“)

Weight

1290 kg (2843.96 lbs)

Max. PCB size batch mode

635 x 444 x 70 (25.00 x 17.48 x 2.76”) with vacuum
635 x 444 x 80 mm (25.00 x 17.48 x 3.15”) without vacuum

Max. PCB size inline mode

630 x 400 x 50 mm (24.80 x 15.75 x 1.97”) with vacuum
630 x 400 x 60 mm (24.80 x 15.75 x 2.36”) without vacuum

Max. load on single carrier

7 kg (15.43 lbs)

Liquid agent filling

40 kg (88.18 lbs)

Water connection

½” / 2,5 – 5 bar

Max. heating capacity

10,4 kW

Average power consumption

5,5 kW/h

Power supply

400 / 230 VAC, 50Hz

Main fuse

32A „gl“ or „C“

External vacuum module

910 x 550 x 650mm (35.83 x 21.65 x 25.59“), 119 kg (262.35 lbs)

Specifications (Fr) Specifications (Eng)

Process extensions
• Infrared pre-heating
• Vapour descent
• Extended pcb cooling
• Patented Rapid Cooling System (RCS)
• Up to 3 additional temperature measurement channels
• Multi-Level Mode for rapid switching between different soldering heights
• Nitrogen flooding of the cooling and process chamber
Software extensions
• Online Temperature Recording Software (TRS) for data analysis and storage including alarm and event log
• Pilot mode, measurement channel for easy temperature-controlled soldering and setting up of profiles
• Various traceability extensions, for automated processes and tracking, ready for Industry 4.0
Hardware extensions
• Automatic adjustment of transport lane width and work piece carrier
• Larger transport width
• Measurement carrier for thermal profiling
• Wireless 6-Channel Profiler for thermal profiling during vacuum phase
• Batch carrier and stainless-steel grid
• Adapter for double sided boards on batch carrier
• TE-Adapter for simple plug-in of PCB-thermocouples
• Heavy Duty “HD” model for loads up to 14 kg with stronger heating capabilities
• Exhaust system extensions and 2nd Emergency stop button
• UPS – Uninterruptable Power Supply
• ReSy – a device for repair of QFPs and BGAs
• Expanded medium filter system including medium levelling and fast cooling system
• Noise protection for vacuum tower
• Storage compartment for carrier
• Integration of a bypass system
• Chiller for inside or outside use with automatic standby control

  • Comfortable 15” Touch Screen mounted on a swiveling arm
  • Integrated PC, allows permane n t data collection and professional data management
  • Permanent data collection
  • Unlimi ted program memory with a large amount of sample programs
  • Network capable
  • Password protected operation levels
  • Heating power monitoring
  • Energy manageme nt system
  • Intelligent Profiling System (IPS) for high end thermal profil e control
  • Buffer in the loading and unloading areas
  • Automatic loading and unloading Work Piece Carrier
  • Patented vibration and maintenance free transport system
  • Two chamber design and medium recovery results in a very low fluid consumption
  • Fluid level control and automatic filtering
  • Patented vacuum chamber design inside of the process chamber
  • Controllable vacuum generation set up in steps, multi vacuum or linear mode
  • Integrated fans with global bottom cooling
  • Minimal maintenance and wear due to all moving parts mounted outside of the process chamber
  • Easy access to solder chamber for cleaning and maintenance purposes
  • Observation window into the solder chamber
  • Signal light tower
  • Exhaust connection
  • Co ol handling transport system in cool area
  • Patented vibration and maintenance free transport system
  • Two chamber design and medium recovery results in a very low fluid consumption
  • Fluid level control and automatic filtering
  • Integrated cooling fans
  • Minimal maintenance and wear due to all moving parts mounted outside of the process chamber
  • Easy access to solder chamber for cleaning and maintenance purposes
  • Observation window into the solder chamber
  • Exhaust connection
  • Cool handling transport system in cool area

Features

  • Powerful unit for highest demands
  • Different machine types with carrier sizes
  • Small footprint
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software (VP- Control) without profiler
  • Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts

Different sizes are available on request

The group

 

We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.

A 360° value proposition in thermal equipment for research laboratories and industry

 

Tailor-made and standard technology solutions for a wide range of applications

 

A unique and advanced technological solution dedicated to the oxidation phase involved in the manufacture of VCSELs

 

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