VAC Inline

Inline Vapor Phase Reflow

The VAC Inline Series is an environmentally friendly and flexible
soldering system dedicated for highest quality soldering. This
machine can be fully integrated into a production line and if
necessary also be used in the batch mode The patented vacuum
chamber located in the process chamber ensures that highest
solder quality with a minimum amount and size of voids is possible.
Outstanding performance and quality results through the unique
technology applied in these machines. Regardless of the number of
layers in the board and high mix of components this machine can
handle the tough est applications with fantastic results. The
Intelligent Profiling System gives the user full control of temperature
rise to reach the best and desired soldering profiles. Together with
the unique patented Soft Vapour Phase there is no fear of
exceeding temperature increase rates of component s. Their
outstanding low energy consumption and exhaust air volume
compared to other soldering systems result in even lower running
costs. Excellent heat transfer in an inert oxygen free atmosphere
without the need of costly nitrogen. Two chamber system wi th a
large touch display makes this machine user friendly, easy to set up
and use. Soldering is possible regardless of assembly weight with
the same profile.

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Caractéristiques

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Description

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	Caractéristiques (Fr)	Specifications (Eng)
Width		2040 mm – (80,31“)
Depth		3040 mm – (119.69“)
Height		1470 mm – (57.87“)
Weight		1290 kg (2843.96 lbs)
Max. PCB size batch mode		635 x 444 x 70 (25.00 x 17.48 x 2.76”) with vacuum 635 x 444 x 80 mm (25.00 x 17.48 x 3.15”) without vacuum
Max. PCB size inline mode		630 x 400 x 50 mm (24.80 x 15.75 x 1.97”) with vacuum 630 x 400 x 60 mm (24.80 x 15.75 x 2.36”) without vacuum
Max. load on single carrier		7 kg (15.43 lbs)
Liquid agent filling		40 kg (88.18 lbs)
Water connection		½” / 2,5 – 5 bar
Max. heating capacity		10,4 kW
Average power consumption		5,5 kW/h
Power supply		400 / 230 VAC, 50Hz
Main fuse		32A „gl“ or „C“
External vacuum module		910 x 550 x 650mm (35.83 x 21.65 x 25.59“), 119 kg (262.35 lbs)

	Caractéristiques (Fr)	Specifications (Eng)
Process extensions • Infrared pre-heating • Vapour descent • Extended pcb cooling • Patented Rapid Cooling System (RCS) • Up to 3 additional temperature measurement channels • Multi-Level Mode for rapid switching between different soldering heights • Nitrogen flooding of the cooling and process chamber Software extensions • Online Temperature Recording Software (TRS) for data analysis and storage including alarm and event log • Pilot mode, measurement channel for easy temperature-controlled soldering and setting up of profiles • Various traceability extensions, for automated processes and tracking, ready for Industry 4.0 Hardware extensions • Automatic adjustment of transport lane width and work piece carrier • Larger transport width • Measurement carrier for thermal profiling • Wireless 6-Channel Profiler for thermal profiling during vacuum phase • Batch carrier and stainless-steel grid • Adapter for double sided boards on batch carrier • TE-Adapter for simple plug-in of PCB-thermocouples • Heavy Duty “HD” model for loads up to 14 kg with stronger heating capabilities • Exhaust system extensions and 2nd Emergency stop button • UPS – Uninterruptable Power Supply • ReSy – a device for repair of QFPs and BGAs • Expanded medium filter system including medium levelling and fast cooling system • Noise protection for vacuum tower • Storage compartment for carrier • Integration of a bypass system • Chiller for inside or outside use with automatic standby control

Comfortable 15” Touch Screen mounted on a swiveling arm
Integrated PC, allows permane n t data collection and professional data management
Permanent data collection
Unlimi ted program memory with a large amount of sample programs
Network capable
Password protected operation levels
Heating power monitoring
Energy manageme nt system
Intelligent Profiling System (IPS) for high end thermal profil e control
Buffer in the loading and unloading areas
Automatic loading and unloading Work Piece Carrier
Patented vibration and maintenance free transport system
Two chamber design and medium recovery results in a very low fluid consumption
Fluid level control and automatic filtering
Patented vacuum chamber design inside of the process chamber
Controllable vacuum generation set up in steps, multi vacuum or linear mode
Integrated fans with global bottom cooling
Minimal maintenance and wear due to all moving parts mounted outside of the process chamber
Easy access to solder chamber for cleaning and maintenance purposes
Observation window into the solder chamber
Signal light tower
Exhaust connection
Co ol handling transport system in cool area
Patented vibration and maintenance free transport system
Two chamber design and medium recovery results in a very low fluid consumption
Fluid level control and automatic filtering
Integrated cooling fans
Minimal maintenance and wear due to all moving parts mounted outside of the process chamber
Easy access to solder chamber for cleaning and maintenance purposes
Observation window into the solder chamber
Exhaust connection
Cool handling transport system in cool area

pyrox-division-electronique-ibl-gamme-vac-low.pdf

Features

Powerful unit for highest demands
Different machine types with carrier sizes
Small footprint
Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
Easy one step profile set-up with Intelligent profiling system (IPS)
Wide variety of adjustable solder profiles
Lead-free and leaded soldering on one machine with one fluid
Live temperature monitoring with IBL Software (VP- Control) without profiler
Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
Low maintenance due to Cool Handling (all moving parts outside process chamber)
Maintenance-free transport system (patented)
Integrated automatic fluid filter system
Observation window into process chamber
Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts

Different sizes are available on request

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Nous avons la capacité de proposer à nos clients une approche « de bout en bout » grâce à nos compétences techniques et à l’expérience de nos équipes.