Reflow furnace

 

Vapor phase soldering is very different from other technologies and has many advantages for electronic board soldering, polymerisation, soldering of loads with high thermal inertia. Among others, vapor phase reflow is of great interest for lead-free soldering.
 


 

Vapor phase soldering = a simple process

Maximum temperature of the liquid = boiling point of the liquid.

Boiling point of the liquid = maximum temperature of the vapor.

(Liquid range according to type of brazing from 55 to 260°C)

 

 

The boiling point of the liquid determines the maximum temperature of the whole process
Only 1 parameter determines the maximum temperature of the whole process
Lead and lead-free technologies.
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