Process
Suitable for all SMT soldering applications (simple or highly complex PCBs). Assembly mass up to 15 kg.
Quality
Solder joint with uniform temperature, void reduction, soldering in an inert atmosphere without the use of N₂ gas.
Economical
Low power consumption from 0.9 to 4.9 kWh depending on the model. Low maintenance cost (once a year). Part of an eco-friendly approach.
From prototyping (benchtop ovens) to mass production (inline ovens). IBL offers solutions tailored to every need.
Uniform heat transfer, reflow peak of only 230°C or 240°C, no cold joints and no overheating of joints.
Vapor phase allows processing of both standard PCBs and components and/or PCBs with very high thermal mass (FR4/polyimides, multilayers, ceramics, SMIs, IGBTs, LGAs, BGAs including Fine Pitch, LEDs, ELKO capacitors, SOT transistors, large thermal masses, shields, ferrites, transformers, etc.).
High-quality leaded/lead-free soldering
Uniform heat transfer, no ΔT, minimum soldering temperatures without cold joints… (less thermal stress on components).
Easy implementation and compact footprint
Flexible operation, fast setup, instant production changes with no waiting time, full process visibility.
100% inert gas atmosphere without nitrogen use
No oxidation, improved solder wetting quality.
Void-free soldering with the VAC series equipped with vacuum function
From Fine Pitch to large soldering areas.
From prototyping to high-volume production
Equipment available in batch and inline versions for mass production.
Very low production costs and minimal maintenance
Power consumption of only 0.9 to 4.9 kWh depending on the machine, one maintenance per shift annually.
Vapor phase soldering is very different from other technologies and offers numerous advantages for soldering electronic boards, curing, and soldering assemblies with high thermal inertia. Among other benefits, vapor phase reflow is particularly well-suited for lead-free soldering.
1. The boards are placed on a support tray. The entire assembly is brought into the vapor zone. It can be preheated by the upper area of the vapor phase. Using preheating improves soldering quality and allows for flexible temperature profile formation.
2. The assembly is immersed in the vapor. Thanks to a patented process, the user can control the heating rate (thermal transfer of the assembly).
3. The vapor condenses on the PCB and transfers its heat. Since the vapor is chemically inert, it creates an inert gas atmosphere with 0 ppm oxygen. This process is fully automatic and does not require nitrogen.
4. The assembly can reach a maximum temperature equal to that of the vapor. This temperature cannot be exceeded, even if the assembly remains in the vapor for an extended time. As a result, overheating of the boards is not possible.
5. After exiting the vapor phase, some fluid may still be condensed on the board. Due to the latent heat of the assembly, the liquid evaporates, and a dry assembly exits the machine.
Vapor phase soldering is very different from other technologies and offers numerous advantages for soldering electronic boards, curing, and soldering assemblies with high thermal inertia. Among its many benefits, vapor phase reflow is particularly well-suited for lead-free soldering.
