The VAC 645 and VAC 665 reflow furnaces (available in batch or in-line versions) guarantee optimum, void-free soldering quality. Vapor-phase technology combined with the vacuum process (i-version) significantly increases the reliability of the finished product. Soldering is carried out under an inert atmosphere throughout the reflow and vacuum processes. Numerous patented features provide great process flexibility.
| Caractéristiques (Fr) | Specifications (Eng) | ||
|---|---|---|---|
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Largeur du four (batch / en ligne) |
|
1355 mm (53.35“) |
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Longueur |
|
2400 mm (94,49“) |
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Hauteur |
1470 mm |
1470 mm (57,87“) |
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Poids |
1030 kg |
1030kg |
|
|
Hauteur chargement / déchargement. |
900 – 1000 mm (modèles en ligne) |
900 – 1000 mm (modèles en ligne) |
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Taille maximum des cartes (chargement manuel / batch) |
635 x 444 x 70 mm |
635 x 444 x 70 mm |
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|
Remplissage du fluide caloporteur |
40 kg |
40 kg |
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Raccordement eau |
½” / 2,5-5 bar / 2,5l/min |
½” / 2,5-5 bar / 2,5l/min |
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Puissance max. de chauffe |
10,4 kW |
10,4 kW |
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Puissance consommée |
5,5 kW/h |
5,5 kW/h |
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Alimentation électrique |
400/230 VAC, 50Hz, 11 kW |
400/230 VAC, 50Hz, 11 kW |
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Fusible principal |
32A, Typ “gL” ou “C” |
32A, Typ “gL” ou “C” |
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|
Module de vide externe L x l x h, poids |
960 x 610 x 1100 mm, 105 kg |
960 x 610 x 1100 mm, 105 kg |
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
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We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.
A unique and advanced technological solution dedicated to the oxidation phase involved in the manufacture of VCSELs
