Minilab

Batch Soldering

 

The MINILAB is an automated table top reflow soldering machi ne in which the heat is transferred by condensing vapou r. The system is compliant for profiling with standardized manuf acturing specifications without the necessity of program or par ameter set-up. Thanks to the low soldering temperature and h omogeneous heat transfer, the thermal stress on soldering assemblies is kept at the minimum. Together with its simple and safe soldering process this unit is ideal for the use in the development and prototyping. This entry system is a manu al top loader, includes standard soldering profiles and is easy t o move. Soldering is possible regardless of assembly weight.

 

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Specifications (Fr) Specifications (Eng)

Width

715 mm (28.15“)

Depth

625 mm (24.61“)

Height

580 mm (22.83“)

Weight

70 kg (154.32 lbs)

Max. PCB size

304 x 274 x 80 mm (11.97 x 10.79 x 3.14“)

Max. load on single carrier

2 kg (4,41 lbs)

Liquid agent filling

3 kg (6,61 lbs)

Water connection

½“ / 2,5-5 bar

Max. heating capacity

1,8 kW

Average power consumption

0,8 kW/h

Power supply

208-240 VAC, 50/60 Hz

Main fuse

16A „gl“ or „C“

Specifications (Fr) Specifications (Eng)

• Adapter for double sided PCBs
• Stainless steel grid for work piece carrier
• Measurement channel for thermal profiling
• ReSy – a device for repair of QFP’s and BGA’s
• External cooling device

• Oxygen free soldering without overheating of components
• Patented maintenance and vibration free transport system
• Patented closure of the solder chamber during the load and unloading process
• Fluid recovery system
• Illuminated window into the process chamber
• Patented automatic or time-controlled soldering process
• 5” HMI touch panel
• Several steps within a program
• Program storage including standard soldering profiles
• SD slot for storing of profiles and machine data
• Easy maintenance

Features

  • Ideal for development, prototyping, rework and mini series production
  • Board sizes up to 300 x 275 x 80 mm
  • Table top unit
  • Low energy and fluid consumption with integrated heat exchanger
  • Easy operation, solder automatic
  • Maintenance-free transport system (patented)
  • Observation window into process chamber
  • 230 Volt operation

The group

 

We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.

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