The BLC inline model is an environmentally friendly and flexible
system for high quality soldering. The most complex soldering
applications can be easily mastered with this machine. A high mix of
large and small components can simultaneously get soldered without
overheating any of them. This machine can be fully integrated into a
production line and if necessary also be used in the batch mode. The
Intelligent Profiling System gives the user full control of temperature
rise to reach the best soldering profiles. Together with the unique
patented Soft Vapour Phase there is no fear of exceeding
temperature increase rates of components. Their outstanding low
energy consumption and exhaust air volume compared to other
soldering systems result in even lower running costs. Excellent heat
transfer in an inert oxygen free atmosphere without the need of costly
nitrogen. The two-chamber system with a large user-friendly touch
display makes this machine easy to set up and use. Soldering is
possible regardless of assembly weight with the same profile.
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
|
Width |
2020 mm (75.73“) |
|
|
Depth |
2490 mm (98.03“) |
|
|
Height |
1470 mm (57.87“) |
|
|
Weight |
920 kg (2028.25 lbs) |
|
|
Max. PCB size inline modus |
630 x 400 x 55 mm (24.80 x 15.75 x 2.17“) |
|
|
Max. PCB size batch mode |
650 x 540 x 80mm |
|
|
Max. load on single carrier |
7 kg (15.43 lbs) |
|
|
Liquid agent filling |
20 kg (40.10 lbs) |
|
|
Water connection |
½” / 2,5 – 5 bar |
|
|
Max. heating capacity |
7,8 kW |
|
|
Average power consumption |
3,2 kW/h |
|
|
Power supply |
400 / 230 VAC, 50/60Hz |
|
|
Main fuse |
20A „gl“ or „C“ |
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
|
Process extensions
|
Features
• Comfortable 15” Touch–Screen mounted on a swiveling arm
• Integrated PC, allows permanent data collection and professional data management
• Permanent data collection
• Unlimited program memory with a large amount of sample programs
• Network capable
• Password protected operation levels
• Energy management system
• Intelligent Profiling System (IPS) for high–end thermal profile control
• Buffer in the loading and unloading areas
• Automatic loading and unloading Work Piece Carrier
• Signal light tower
• Patented vibration and maintenance free transport system
• Two chamber design and medium recovery results in a very low fluid consumption
• Fluid level control and automatic filtering
• Integrated cooling fans
• Minimal maintenance and wear due to all moving parts mounted outside of the process chamber
• Easy access to solder chamber for cleaning and maintenance purposes
• Observation window into the solder chamber
• Exhaust connection
• Cool handling – transport system in cool area
We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.
A unique and advanced technological solution dedicated to the oxidation phase involved in the manufacture of VCSELs
