The BLC–Series is an environmentally friendly and flexible system
for high quality soldering. With the premium series the most
complex soldering applications can be easily mastered. A high mix
of large and small components can simultaneously get soldered
without overheating any of them. The Intelligent Profiling System
gives the user full control of temperature rise to reach the best
soldering profiles. Together with the unique patented Soft Vapour
Phase there is no fear of exceeding temperature increase rates of
components. Their outstanding low energy consumption and
exhaust air volume compared to other soldering systems result in
even lower running costs. Excellent heat transfer in an inert
oxygen free atmosphere without the need of costly nitrogen. The
two–chamber system with a large touch display makes this
machine user friendly, easy to set up and use. Soldering is
possible regardless of assembly weight with the same profile.
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
|
Width |
1060 mm (41.73“) |
|
|
Depth |
1960 mm (77.17“) |
|
|
Height |
1320 mm (51.97) |
|
|
Weight |
520 kg (1146.40lbs) |
|
|
Max. PCB size |
450 x 540 x 80 mm |
|
|
Max. load on single carrier |
7 kg (15.43 lbs) |
|
|
Liquid agent filling |
15 kg (33.07 lbs) |
|
|
Water connection |
½“ / 2,5-5 bar |
|
|
Max. heating capacity |
6,4 kW |
|
|
Average power consumption |
2,6 kW/h |
|
|
Power supply |
400 / 230 VAC, 50/60Hz |
|
|
Main fuse |
20A „gl“ or „C“ |
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
|
Process extensions |
Features:
• Comfortable 15” Touch–Screen
• Integrated PC, allows permanent data collection and professional data management
• Permanent data collection
• Unlimited program memory with a large amount of sample programs
• Network capable
• Password protected operation levels
• Energy management system
• Intelligent Profiling System (IPS) for high–end thermal profile control
• Automatic in– and outlet of the Work Piece Carrier
• Patented vibration and maintenance free transport system
• two chamber design and medium recovery results in a very low fluid consumption
• Fluid level control and automatic filtering
• Integrated cooling fans
• Minimal maintenance and wear due to all moving parts mounted outside of the process chamber
• Easy access to solder chamber for cleaning and maintenance purposes
• Observation window into the solder chamber
• Exhaust connection
• Cool handling – transport system in cool area
• Global bottom cooling
• 5” HMI touch display
• Program storage including standard soldering programs
• Illuminated observation window into the solder chamber
• SD slot for storing of profiles and machine data
• Simple access for maintenance
• Fluid filter system
• Exhaust connection
• Cool handling – transport system in cool area
Features
We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.
A unique and advanced technological solution dedicated to the oxidation phase involved in the manufacture of VCSELs
